王中王六合彩特码

Deadline of submission is on October 16, 2009.

Please send your resume with photo and transcript of records thru e-mail not later than October 16, 2009 to kc.kare@analog.com

JUNIOR ENGINEER
(as E05 Junior Engineer (New College Graduate) for GT HR)

Qualifications:

• Graduate of BS Electronics & Communications, Electrical Engineering, Computer Engineering, Mechanical Engineering.
• Proficient in circuit analysis.
• Knowledgeable in Pascal or C Programming language.
• Good scholastic records.
• Good communication and interpersonal skills.
• Proven leadership skills.
• Must be a FRESH GRADUATE (no prior work experience).

Brief Job Description:
The Junior Engineer is responsible for the following activities:

1. Provide support to manufacturing and ensure product testability with respect to published electrical specifications or datasheets to the highest quality and reliability;
2. Responsible tester maintenance and improvement activities;
3. Ensure completion of full failure analysis on customer returns, OQA failures, Reliability Monitor Program (RMP) failures, Reliability Assessment failures, Qualification/Certification failures, and failures pertaining to Special Occurrences (SO鈥檚); and
4. Involve in the whole systems development life cycle (SDLC) focusing on computer integrated manufacturing(CIM), test data management, and process improvement.

MANUFACTURING TEST ENGINEERS (2)
(as E05-E07 Migration Engineer for GT Mfg Test Eng鈥檊)

Qualifications:

• At least 2 years experience in final test, wafer probe/sort, test development, or any related field in semiconductor and electronics.
• Graduate of BS ECE/EE.
• Proficient in Circuit Analysis.
• Knowledgeable in C++ and Visual Basic.
• Familiar with linear and mixed signal testing.
• Excellent communication skills.
• Fresh graduates are welcome to apply.

Brief Job Description:

He/She will be responsible to provide support to manufacturing and ensure product testability with respect to published electrical specifications or datasheets to the highest quality and reliability.

QUALITY ENGINEER
(as E06-E07 Product Analysis Engineer for WW Product Analysis)

Qualifications:

• Graduate of BS Materials Engineering, Physics, EE, or ECE.
• At least 3 years of work experience in a semiconductor test or assembly manufacturing facility.
• Familiar with FA processes, techniques, and equipment such as SEM/EDX, X-ray, CSAM, LEM, Bench Equipment and Optical Microscopes.
• Knowledgeable in data analysis and reporting.
• Good oral and written communication skills.
• Good interpersonal skills.

Brief Job Description:

The Product Analysis Engineering Specialist is responsible in FA Techniques development and enhancement, equipment maintenance and support to the needs of full failure analysis of customer returns, OQA failures, RMP failures, Reliability Assessment failures and failures pertaining to Sprecial Occurrences (SO's).

MANUFACTURING TEST ENGINEER
(as E05-E09 Wafer Probe Engineer for ADGT Test Engineering)

Qualifications:

• Graduate of BS Electronics & Communications & Electrical Engineering.
• At least 2 years experience in final test, wafer probe/sort, test development, or any related field in semiconductor and electronics.
• Proficient in circuit analysis.
• Knowledgeable in Pascal or C Programming language.
• Familiar with linear and mixed-signal testing.
• Excellent communication skills.
• Fresh graduates are welcome to apply.

Brief Job Description:

The Test/Product Engineer is responsible to provide support to manufacturing and ensure product testability with respect to published electrical specifications or datasheets to the highest quality and reliability.

TEST DEVELOPMENT ENGINEER
(As E07-E09 Test Development Engineer for ADGT Test Engineering)

Qualifications:

• Graduate of BS Electronics and Communications / Electrical Engineering.
• MS units in related engineering field is an advantage.
• At least 3 years experience in a semiconductor manufacturing environment.
• Familiar in software programming using Unix-based C programming.
• Knowledgeable in bench testing, die level circuit analysis, failure analysis, and instrumentation.
• Experience in sensors, electro-mechanical systems/products or MEMS is an added advantage.
• Good oral and written communication skills.

Brief Job Description:

The Test Development Engineer will be working closely with product line teams to lead efforts to understand root causes and execute corrective actions to meet expected performance, and quality and reliability for new products during development and release stages. He/She will define and conduct experiments, analyze/report data, and formulate conclusions that will lead to appropriate strategies in solving problems.

MANUFACTURING TEST ENGINEER
(as E05-E09 Wafer Level Die Prep Process Engineer for Mfg Support Eng鈥檊)

Qualifications

• Graduate of BS ECE, EE, ME, MatSci/Metallurgical Eng鈥檊.
• 2 years experience in a semiconductor manufacturing company.
• Experience in backgrind process is an advantage.
• Knowledgeable in saw, pick and place/tape and reel/inspection process.
• Proficient in FMEA, DOE, and SPC.
• Good communication and interpersonal skills.
• Good leadership skills

Brief Job Description

The Manufacturing Support Engineer will be assigned in Wafer Level Die Prep Process and will focus on activities concerning process creation and improvements. He/She will also sustain the WLCSP鈥檚 backend performance metrics in terms of yield, materials and cost reductions.

Please send your resume with photo and transcript of records thru e-mail not later than October 16, 2009 to kc.kare@analog.com